MT29C1G12MAADYAKD-5 IT
Micron
Multichip PackagesMemory
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46,309 part recordsMT29C4G48MAYBBAMR-48 IT
Micron · Package: VFBGA-130
Multichip Packages MASSFLASH/MOBILE DDR 6GMT29C2G24MAAAAKAKD-5 IT
Micron
Multichip Packages MASSFLASH/MOBILE DDR 3GMT29RZ1CVCZZHGTN-18 I.85H
Micron
Multichip Packages MASSFLASH/LPDDR2 1.5GMT29C2G24MAAAAKAMD-5 IT TR
Micron · Package: VFBGA-130
Multichip Packages MASSFLASH/MOBILE DDR 3GW71NW11GC1HW
Winbond
Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR1 MCP x16/x32W71NW10GC1HW
Winbond
Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR1 MCP x8/x16S71KL512SC0BHB003
Cypress Semiconductor
Multichip Packages NorW25M512JVEIM
Winbond · Package: WSON-8
Multichip Packages spiFlash, 3V, 512M-bit, 4Kb Uniform Sector, DTRS71KS512SC0BHB003
Cypress Semiconductor · Package: FBGA-24
Multichip Packages NorMT29RZ4B4DZZMGWD-18I.80C TR
Micron · Package: VFBGA-162
Multichip Packages MASSFLASH/LPDDR2 8GMT29VZZZAD8DQKSL-046 W.9K8
Micron
Multichip Packages eMCP 544Gb (2xNAND B16A TLC 256Gb+4xDRAM LPDDR4 8Gb)MT38Q3DABD-DC
Micron
Multichip Packages SERIAL/MOBILE DDR 4.5GMT29RZ4B2DZZHHTB-18W.80F TR
Micron · Package: VFBGA-162
Multichip Packages MASSFLASH/LPDDR2 6GW25M512JVFIM
Winbond · Package: SOIC-16
Multichip Packages spiFlash, 3V, 512M-bit, 4Kb Uniform Sector, DTRW25M121AWEIT
Winbond
Multichip Packages 1Gb Serial NAND flash 1.8V + 128Mb Serial Flash 1.8V MCPW25M512JVFIQ TR
Winbond · Package: SOIC-16
Multichip Packages spiFlash, 512M-bit, 4Kb Uniform SectorW25M512JWEIM
Winbond · Package: WSON-8
Multichip Packages spiFlash, 1.8V, 512M-bit, 4Kb Uniform Sector, DTRW25M321AVEIT
Winbond · Package: WSON-8
Multichip Packages 1Gb Serial NAND flash 3V + 32Mb Serial Flash 3V MCPW25M512JWEIQ
Winbond · Package: WSON-8
Multichip Packages spiFlash, 1.8V, 512M-bit, 4Kb Uniform SectorTechnical data and documents are for checking references only and do not represent current stock, price, lead time, supply source, or replacement conclusions.