ChipSourceHub

Winbond

W71NW10GC1HW

Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR1 MCP x8/x16

Basic Information

Manufacturer
Winbond
Product Category
Multichip Packages
Series
W71NW10GC
Mounting Style
SMD/SMT
Packaging
Tray
RoHS
Compliant (source record)

Technical Specifications

10 parameters
Type
NAND Flash, LPDDR1
Memory Size
1 Gbit, 512 Mbit
Maximum Clock Frequency
29 MHz, 200 MHz
Minimum Operating Temperature
- 40 C
Maximum Operating Temperature
+ 85 C
Organization
128 M x 8, 32 M x 16
Data Bus Width
8 bit, 16 bit
Moisture Sensitive
Yes
Supply Voltage - Max
1.95 V
Supply Voltage - Min
1.7 V

Technical data, historical stock, and reference prices are for verification only. Confirm current supply, quotation, and lead time through inquiry. Similar parameters do not establish direct replacement.

W71NW10GC1HW Specifications and Datasheet | ChipSourceHub