ChipSourceHub

Infineon Technologies

FF6MR20W2M1HQB70BPSA1

Discrete Semiconductor Modules EasyPACK 2B module with CoolSiC Trench MOSFET and PressFIT / NTC / TIM

Basic Information

View Datasheet ↗
Manufacturer
Infineon
Brand
Infineon Technologies
Product Category
Discrete Semiconductor Modules
Series
EasyPACK
Package
EasyPACK
Mounting Style
Press Fit
Packaging
Tray

Technical Specifications

16 parameters
Product
Module
Technology
SiC
Vf - Forward Voltage
4.4 V
Vgs - Gate-Source Voltage
- 7 V, + 20 V
Minimum Operating Temperature
- 40 C
Maximum Operating Temperature
+ 150 C
Fall Time
23 ns
Id - Continuous Drain Current
160 A
Rds On - Drain-Source Resistance
8.1 mOhms
Rise Time
53 ns
Tradename
CoolSiC
Typical Turn-Off Delay Time
105 ns
Show more parameters (4)
Typical Turn-On Delay Time
65 ns
Vds - Drain-Source Breakdown Voltage
2 kV
Vgs th - Gate-Source Threshold Voltage
5.15 V
Part # Aliases
FF6MR20W2M1HQ_B70 SP006088293

Technical data, historical stock, and reference prices are for verification only. Confirm current supply, quotation, and lead time through inquiry. Similar parameters do not establish direct replacement.

FF6MR20W2M1HQB70BPSA1 Specifications and Datasheet | ChipSourceHub