Infineon Technologies
FS1150R08A8P3CHPSA1
Discrete Semiconductor Modules HybridPACK Drive G2 module
Basic Information
View Datasheet ↗- Manufacturer
- Infineon
- Brand
- Infineon Technologies
- Product Category
- Discrete Semiconductor Modules
- Series
- HybridPACK
- Package
- DIP-7
- Mounting Style
- Press Fit
- Packaging
- Tray
Technical Specifications
18 parameters- Product
- Power Modules
- Type
- Drive G2 Module
- Technology
- SiC
- Vf - Forward Voltage
- 1.76 V
- Vr - Reverse Voltage
- 400 V
- Minimum Operating Temperature
- - 40 C
- Maximum Operating Temperature
- + 175 V
- Configuration
- Sixpack
- Country of Origin
- DE
- Fall Time
- 91 ns
- Id - Continuous Drain Current
- 600 A
- Pd - Power Dissipation
- 1 kW
Show more parameters (6)
- Rise Time
- 50 ns
- Typical Turn-Off Delay Time
- 929 ns
- Typical Turn-On Delay Time
- 222 ns
- Vds - Drain-Source Breakdown Voltage
- 750 V
- Vgs th - Gate-Source Threshold Voltage
- 5.8 V
- Part # Aliases
- FS1150R08A8P3C SP006071554
Technical data, historical stock, and reference prices are for verification only. Confirm current supply, quotation, and lead time through inquiry. Similar parameters do not establish direct replacement.