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Winbond

W71NW11GBADW

Multichip Packages 1G-bit 1.8V NAND + 256Mb LPDDR1 MCP x16/x16

Basic Information

Manufacturer
Winbond
Product Category
Multichip Packages
Series
W71NW11GB
Mounting Style
SMD/SMT
Packaging
Tray
RoHS
Compliant (source record)

Technical Specifications

7 parameters
Type
NAND Flash, LPDDR1
Memory Size
1 Gbit, 256 Mbit
Organization
64 M x 16, 16 M x 16
Data Bus Width
16 bit
Moisture Sensitive
Yes
Supply Voltage - Max
1.95 V
Supply Voltage - Min
1.7 V

Technical data, historical stock, and reference prices are for verification only. Confirm current supply, quotation, and lead time through inquiry. Similar parameters do not establish direct replacement.

W71NW11GBADW Specifications and Datasheet | ChipSourceHub