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Kingston

08EP08-N3GTC32-GA67

Multichip Packages 8GB+8Gb 136 ball ePoP

Basic Information

View Datasheet ↗
Manufacturer
Kingston
Product Category
Multichip Packages
Package
FBGA-136
Mounting Style
SMD/SMT
Packaging
Tray

Technical Specifications

7 parameters
Memory Size
8 Gbit, 8 Gbit
Minimum Operating Temperature
- 25 C
Maximum Operating Temperature
+ 85 C
Country of Origin
TW
Interface Type
eMMC 5.1
Moisture Sensitive
Yes
Unit Weight
0.005714 oz

Technical data, historical stock, and reference prices are for verification only. Confirm current supply, quotation, and lead time through inquiry. Similar parameters do not establish direct replacement.

08EP08-N3GTC32-GA67 Specifications and Datasheet | ChipSourceHub