ZSSC4161DE1B
Renesas Electronics · Package: Die
Sensor Interface UNSAWN WAFER IN WAFER BOXSearch components by part number, manufacturer and category.
Renesas Electronics · Package: Die
Sensor Interface UNSAWN WAFER IN WAFER BOXRenesas Electronics · Package: Die
Sensor Interface TESTED WAFER -CFG 4161_0500_03 V2.2Renesas Electronics · Package: Die
Sensor Interface SAWN WAFER ON WAFER FRAMERenesas Electronics · Package: Die
Sensor Interface TESTED DIE, SAWN ON FOIL -CFG 4161_0500_Renesas Electronics · Package: Die
Sensor Interface DICE (WAFER SAWN) - WAFFLE PACKRenesas Electronics · Package: VFQFPN-24
Sensor Interface PQFN / 24 / 4X4MM S1 - TAPE&REEL - 13Renesas Electronics · Package: QFN-24
Sensor Interface QFN24 PACKAGE - CFG 4161_0500_03 V2.2Renesas Electronics · Package: QFN-24
Sensor Interface PQFN / 24 / 4X4MM SLP - TAPE&REEL - 13Renesas Electronics
Sensor Interface WAFER (UNSAWN) - WAFER BOXRenesas Electronics · Package: QFN-24
Sensor Interface DICE (WAFER SAWN) - FRAMERenesas Electronics · Package: Die
Sensor Interface TSSOP / 16 / 5X4MM-0Renesas Electronics · Package: TSSOP-16
Sensor Interface TSSOP / 16 / 5X4MM -0Renesas Electronics · Package: VFQFPN-24
Sensor Interface Thermocouple interfaceRenesas Electronics · Package: QFN-24
Sensor Interface PQFN / 24 / 4X4MM S1 - TAPE&REEL - 13Silicon Labs · Package: DFN-10
Sensor InterfaceSilicon Labs · Package: DFN-10
Sensor InterfaceSilicon Labs · Package: DFN-10
Sensor Interface Optical Sensor AEC-Q100Silicon Labs · Package: DFN-10
Sensor Interface Optical Sensor AEC-Q100STMicroelectronics
Sensor Interface PEIMSTMicroelectronics
Sensor Interface Time-of-Flight (ToF) ranging sensor 940nm laser VSCEL leading-edge SPAD arrayTechnical data and documents are for checking references only and do not represent current stock, price, lead time, supply source, or replacement conclusions.