NCH-RSL10-101Q48-ABG
onsemi · Package: QFN-48
RF System on a Chip - SoC Radio SoC Ultr Low PwrRF and Wireless
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20,447 part recordsNCH-RSL10-101S51-ACG
onsemi · Package: SIP-51
RF System on a Chip - SoC RSL10 SIPNCH-RSL10-101WC51-ABG
onsemi · Package: WLCSP-51
RF System on a Chip - SoC Ultra Low Power SoC 51 Bump WLCSPNCV-RSL10-101Q48-AVG
onsemi · Package: QFNW-48
RF System on a Chip - SoC RSL10 RadioSoC Ultra Low Power BLE5DA14531-01000OG2
Renesas / Dialog · Package: WLCSP-17
RF System on a Chip - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 6 GPIOs in WL-CSP17 and 0.5mm ball pitch packageDA14533-00A02RN2
Renesas / Dialog
RF System on a Chip - SoC Automotive Bluetooth Low Energy 5.3 SoC with integrated ARM Cortex-M0+, memories and peripherals, compliant with the AEC-Q100 (Grade 2) standardDA14535-00000FX2
Renesas / Dialog · Package: QFN-24
RF System on a Chip - SoC Bluetooth Low Energy 5.3 SoC with integrated ARM Cortex-M0+, memories and peripherals ? 12 GPIOs in FCGQFN24 and 0.4mm ball pitch packageDA14580-01A32
Renesas / Dialog · Package: QFN-48
RF System on a Chip - SoC Bluetooth Low Energy 4.2 SoC with integrated ARM Cortex M0, memories and peripherals 32 GPIOs in QFN48 and 0.4mm pin pitch packageDA14580-01AT2
Renesas / Dialog · Package: QFN-40
RF System on a Chip - SoC Bluetooth Low Energy 4.2 SoC with integrated ARM Cortex M0, memories and peripherals 24 GPIOs in QFN40 and 0.4mm pin pitch packageDA14580-01UNA
Renesas / Dialog · Package: WLCSP-34
RF System on a Chip - SoC Bluetooth Low Energy 4.2 SoC with integrated ARM Cortex M0, PMU, memories and peripherals ? 12 GPIOsin WL-CSP34 and 0.4mm ball pitch packageDA14581-00AT2
Renesas / Dialog · Package: QFN-40
RF System on a Chip - SoC Bluetooth Low Energy 4.2 SoC optimized for A4WP and HCI applications 24 GPIOs in QFN40 and 0.4mm pin pitch packageDA14581-00UNA
Renesas / Dialog · Package: WLCSP-34
RF System on a Chip - SoC Bluetooth Low Energy 4.2 SoC optimized for A4WP and HCI applications ? 12 GPIOsin WL-CSP34 and 0.4mm ball pitch packageDA14585-00000AT2
Renesas / Dialog · Package: QFN-40
RF System on a Chip - SoC BT5.0 QFN40 SoCDA14585-00000VV2
Renesas / Dialog · Package: WLCSP-34
RF System on a Chip - SoC BT5.0 WL-CSP34 SoCDA14585-00T00AT2
Renesas / Dialog · Package: QFN-40
RF System on a Chip - SoC Bluetooth Low Energy 5.0 SoC with integrated ARM Cortex M0, PMU, memories, voice interface and peripherals, 105degC ? 25 GPIOsin QFN40 and 0.4mm pin pitch packageDA14586-00F02AT2
Renesas / Dialog · Package: QFN-40
RF System on a Chip - SoC BT5.0 QFN40 SoCDA14594-000006F2
Renesas / Dialog
RF System on a Chip - SoC Multi-Core BLE 5.3 SoC with Embedded FLASHDA14594-00000O92
Renesas / Dialog
RF System on a Chip - SoC Multi-Core BLE 5.3 SoC with Embedded FLASHDA14681-01000A92
Renesas / Dialog · Package: AQFN-60
RF System on a Chip - SoC Bluetooth Low Energy 4.2 SoC with Flexpower ARM Cortex M0, crypto, PMU, memories and peripherals - 37 GPIOs in AQFN60 package and 0.55mm pin pitchDA14681-01000U22
Renesas / Dialog · Package: WLCSP-53
RF System on a Chip - SoC Bluetooth Low Energy 4.2 SoC with Flexpower ARM Cortex M0, crypto, PMU, memories and peripherals - 16 GPIOs in WL-CSP53 package and 0.4mm ball pitchTechnical data and documents are for checking references only and do not represent current stock, price, lead time, supply source, or replacement conclusions.