AT28BV64B-20JU
Microchip Technology · Package: PLCC-32
EEPROM 200NS IND TEMP PKG- 200NS IND TEMPMemory
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46,309 part recordsAT24CS64-XHM-B
Microchip Technology · Package: TSSOP-8
EEPROM S/N SEEPROM 64K I2C1MHz 8-TSSOPAT24CS64-XHM-T
Microchip Technology · Package: TSSOP-8
EEPROM SERIAL EEPROM, 64K (8K X 8), 2-WIREAT25640B-MAHL-E
Microchip Technology · Package: UDFN-8
EEPROM 1.8-5.5V, 20MHz, Ind Tmp, 8-UDFNAT25640B-MAHL-T
Microchip Technology · Package: UDFN-8
EEPROM 64K Density SPI 8,192 x 8 OrganAT25640B-SSHL-B
Microchip Technology · Package: SOIC-Narrow-8
EEPROM 64K Density SPI 8,192 x 8 OrganAT25640B-SSHL-T
Microchip Technology · Package: SOIC-Narrow-8
EEPROM 64K Density SPI 8,192 x 8 OrganAT25640B-XHL-B
Microchip Technology · Package: TSSOP-8
EEPROM 64K Density SPI 8,192 x 8 OrganAT25640B-XHL-T
Microchip Technology · Package: TSSOP-8
EEPROM 64K Density SPI 8,192 x 8 OrganAT25256B-MAHL-E
Microchip Technology · Package: UDFN-8
EEPROM 1.8-5.5V, 20MHz, Ind Tmp, 8-UDFNAT28C256-15DM/883
Microchip Technology · Package: CDIP-28
EEPROM 256K 11MIL GRIND - 150NSAT25256B-MAHL-T
Microchip Technology · Package: UDFN-8
EEPROM 256Kbit; SPI Bus High Spd; Mode 0 & 3AT25256B-MAPDGV-T
Microchip Technology · Package: UDFN-8
EEPROM 2.5-5.5v, 5MHz, Auto Grade1, 8-UDFNAT25256B-SSHL-B
Microchip Technology · Package: SOIC-Narrow-8
EEPROM 256Kbit; SPI Bus High Spd; Mode 0 & 3AT25256B-SSHL-T
Microchip Technology · Package: SOIC-Narrow-8
EEPROM 256Kbit; SPI Bus High Spd; Mode 0 & 3AT25256B-SSPDGV-T
Microchip Technology · Package: SOIC-8
EEPROM 2.5-5.5v, 5MHz, A-Tmp, 8-SOICAT25256B-XHL-B
Microchip Technology · Package: TSSOP-8
EEPROM 256Kbit; SPI Bus High Spd; Mode 0 & 3AT25256B-XHL-T
Microchip Technology · Package: TSSOP-8
EEPROM 256Kbit; SPI Bus High Spd; Mode 0 & 3AT25256B-XPDGV-T
Microchip Technology · Package: TSSOP-8
EEPROMAT28C256E-15DM/883-815
Microchip Technology · Package: DIP-28
EEPROM 150NS CERDIPTechnical data and documents are for checking references only and do not represent current stock, price, lead time, supply source, or replacement conclusions.