24FC04HT-I/ST
Microchip Technology · Package: TSSOP-8
EEPROM 4Kb I2C EEPROM, 1MHz 1.7-5.5V, 8-TSSOP, IND W/HALF ARRAY WPMemory
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46,309 part records24FC04HT-I/SN
Microchip Technology · Package: SOIC-8
EEPROM 4Kb I2C EEPROM, 1MHz 1.7-5.5V, 8-SOIC, IND W/HALF ARRAY WP24FC02T-I/SN
Microchip Technology · Package: SOIC-8
EEPROM 2Kb I2C EEPROM, 1MHz 1.7-5.5V, 8-SOIC24VL014/ST
Microchip Technology · Package: TSSOP-8
EEPROM 1K 128 X 8 SERIAL EE 1.5V24FC04T-I/SN
Microchip Technology · Package: SOIC-8
EEPROM 4Kb I2C EEPROM, 1MHz 1.7-5.5V, 8-SOIC34VL02/P
Microchip Technology · Package: PDIP-8
EEPROM 2K 256X8 1.5V SERIAL EEBR93G86FVT-3BGE2
ROHM Semiconductor · Package: TSSOP-B-8
EEPROM McrWre BUS 3-Wre 16K TSSOP-B8 EEPROM93LC76C-I/SN
Microchip Technology · Package: SOIC-8
EEPROM 512x16 or 1024x834AA02-I/SN
Microchip Technology · Package: SOIC-8
EEPROM 2K 256 X 8 18V SERIAL EE INDBR93G56FVT-3AGE2
ROHM Semiconductor · Package: TSSOP-B-8
EEPROM McrWre BUS 3-Wre 2K TSSOP-B8 EEPROM34VL02/ST
Microchip Technology · Package: TSSOP-8
EEPROM 2K 256X8 1.5V SERIAL EE24FC04HT-I/OT
Microchip Technology · Package: SOT-23-5
EEPROM 4Kb I2C EEPROM, 1MHz 1.7-5.5V, 5-SOT23, IND W/HALF ARRAY WPBR93L86FJ-WE2
ROHM Semiconductor · Package: SOP-J-8
EEPROM 3 WIRE SERIALBR93G56FVT-3GE2
ROHM Semiconductor · Package: TSSOP-B-8
EEPROM McrWre BUS 3-Wre 2K TSSOP-B8 EEPROMBR93G56FVT-3BGE2
ROHM Semiconductor · Package: TSSOP-B-8
EEPROM McrWre BUS 3-Wre 2K TSSOP-B8 EEPROMM24C08-FDW6TP
STMicroelectronics · Package: TSSOP-8
EEPROM 8 Kbit serial I2C Bus EEPROMBR93G56FVJ-3AGTE2
ROHM Semiconductor · Package: TSSOP-B8J-8
EEPROM McrWre BUS 3-Wre 2K TSSOP-B8J EEPROMBR24S256FJ-WE2
ROHM Semiconductor · Package: SOP-J-8
EEPROM I2C BUS 256Kbit 1.7-5.5V SupplyBR24G128FVT-3AGE2
ROHM Semiconductor · Package: TSSOP-B-8
EEPROM I2C BUS 128K 16384 8bit EEPROM25AA640AT-I/SN
Microchip Technology · Package: SOIC-8
EEPROM 64K 8K X 8 18V SER EE INDTechnical data and documents are for checking references only and do not represent current stock, price, lead time, supply source, or replacement conclusions.