IS46LQ16256BL-062BLA2
ISSI
DRAM Automotive (Tc: -40 to +105C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 256Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHSSearch components by part number, manufacturer and category.
ISSI
DRAM Automotive (Tc: -40 to +105C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 256Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHSISSI
DRAM Automotive (Tc: -40 to +95C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 256Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&RAlliance Memory
DRAM LPDDR1, 256Mb, 16 x 16 , 1.8V, 60ball VFBGA, Industrial Temp ( -40C to 85C), A DIEAlliance Memory
DRAM LPDDR1, 256Mb, 16 x 16 , 1.8V, 60ball VFBGA, Industrial Temp ( -40C to 85C), A DIE, T&RAlliance Memory
DRAM LPDDR1, 512Mb, 16M x 32 , 1.8V, 90-Ball BGA,200MHz, Industrial Temp ( -40C to 85C), B DIEAlliance Memory
DRAM LPDDR1, 512Mb, 16M x 32 , 1.8V, 90-Ball BGA,200MHz, Industrial Temp ( -40C to 85C), B DIE, T&RAdvantech
DRAM 288pin RDIMM D4 2933 32GB, Hynix 2GX4Winbond · Package: TFBGA-24
DRAM 64Mb HyperRAM x8, 200MHz, Ind temp, 1.8VWinbond
DRAM 1Gb DDR3L 1.35V SDRAM, x16, 1066MHz, Industrial TempZentel Japan · Package: TSOP-II-54
DRAM SDRAM 256Mb, 32Mx8, 166MHz at CL3, 3.3V, TSOPII-54Zentel Japan · Package: TSOP-II-54
DRAM SDRAM 128Mb, 8Mx16, 166MHz at CL3, 3.3V, TSOPII-54Zentel Japan · Package: TSOP-II-54
DRAM SDRAM 256Mb, 16Mx16, 166MHz at CL3, 3.3V, TSOPII-54Zentel Japan · Package: TSOP-II-54
DRAM SDRAM 64Mb, 4Mx16, 166MHz at CL3, 3.3V, TSOPII-54Zentel Japan · Package: TSOP-II-66
DRAM DDR1 256Mb, 16Mx16, 200MHz at CL3, 2.5V, TSOPII-66Micron · Package: TFBGA-200
DRAM LPDDR4 32G 1GX32 FBGA DDPMicron · Package: FBGA-96
DRAM DDR3 8Gbit 16 96/144TFBGA 2 ITMicron · Package: TFBGA-441
DRAM LPDDR5 64Gbit 64 441/441 TFBGA 8 ATMicron · Package: FBGA-96
DRAM DDR3 8Gbit 16 96/144TFBGA 2 ITMicron · Package: FBGA-178
DRAM LPDDR3 8Gbit 32 178/221 VFBGA 1 WTMicron · Package: TFBGA-96
DRAM DDR4 8Gbit 16 96/144TFBGA 1 ITTechnical data and documents are for checking references only and do not represent current stock, price, lead time, supply source, or replacement conclusions.