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Winbond

W71NW10GF3FW

Multichip Packages 1G-bit 1.8V NAND + 1G-bit LPDDR2 MCP x8/x32

Basic Information

Manufacturer
Winbond
Product Category
Multichip Packages
Series
W71NW10GF
Mounting Style
SMD/SMT
Packaging
Tray
RoHS
Compliant (source record)

Technical Specifications

10 parameters
Type
NAND Flash, LPDDR2
Memory Size
1 Gbit, 1 Gbit
Maximum Clock Frequency
29 MHz, 533 MHz
Minimum Operating Temperature
- 40 C
Maximum Operating Temperature
+ 85 C
Organization
128 M x 8, 32 M x 32
Data Bus Width
8 bit, 32 bit
Moisture Sensitive
Yes
Supply Voltage - Max
1.95 V
Supply Voltage - Min
1.7 V

Technical data, historical stock, and reference prices are for verification only. Confirm current supply, quotation, and lead time through inquiry. Similar parameters do not establish direct replacement.

W71NW10GF3FW Specifications and Datasheet | ChipSourceHub