Winbond
W71NW10GE3FW
Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR2 MCP x8/x32
Basic Information
- Manufacturer
- Winbond
- Product Category
- Multichip Packages
- Series
- W71NW10GE
- Mounting Style
- SMD/SMT
- Packaging
- Tray
- RoHS
- Compliant (source record)
Technical Specifications
10 parameters- Type
- NAND Flash, LPDDR2
- Memory Size
- 1 Gbit, 512 Mbit
- Maximum Clock Frequency
- 29 MHz, 400 MHz
- Minimum Operating Temperature
- - 40 C
- Maximum Operating Temperature
- + 85 C
- Organization
- 128 M x 8, 16 M x 32
- Data Bus Width
- 8 bit, 32 bit
- Moisture Sensitive
- Yes
- Supply Voltage - Max
- 1.95 V
- Supply Voltage - Min
- 1.7 V
Technical data, historical stock, and reference prices are for verification only. Confirm current supply, quotation, and lead time through inquiry. Similar parameters do not establish direct replacement.