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Infineon Technologies

FS1150R08A8P3LMCHPSA1

Discrete Semiconductor Modules HYBRID PACK DRIVE G2 SI

Basic Information

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Manufacturer
Infineon
Brand
Infineon Technologies
Product Category
Discrete Semiconductor Modules
Series
G2
Packaging
Tray

Technical Specifications

4 parameters
Technology
Si
Country of Origin
DE
Tradename
HybridPACK
Part # Aliases
FS1150R08A8P3LMC SP005908114

Technical data, historical stock, and reference prices are for verification only. Confirm current supply, quotation, and lead time through inquiry. Similar parameters do not establish direct replacement.

FS1150R08A8P3LMCHPSA1 Specifications and Datasheet | ChipSourceHub