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Infineon Technologies

F411MR12W3M1HB11BPSA1

Discrete Semiconductor Modules EasyPACK module with CoolSiC Trench MOSFET and PressFIT / NTC

Basic Information

View Datasheet ↗
Manufacturer
Infineon
Brand
Infineon Technologies
Product Category
Discrete Semiconductor Modules
Mounting Style
Press Fit
Packaging
Tray

Technical Specifications

18 parameters
Technology
Si
Vf - Forward Voltage
4.2 V
Vgs - Gate-Source Voltage
- 10 V, + 23 V
Minimum Operating Temperature
- 40 C
Maximum Operating Temperature
+ 175 C
Configuration
Quad
Country of Origin
AT
Fall Time
15 ns
Id - Continuous Drain Current
75 A
Pd - Power Dissipation
20 mW
Rds On - Drain-Source Resistance
16 mOhms
Rise Time
15 ns
Show more parameters (6)
Tradename
EasyPACK
Typical Turn-Off Delay Time
57 ns
Typical Turn-On Delay Time
31 ns
Vds - Drain-Source Breakdown Voltage
1.2 kV
Vgs th - Gate-Source Threshold Voltage
5.15 V
Part # Aliases
F4-11MR12W3M1H_B11 SP006060405

Technical data, historical stock, and reference prices are for verification only. Confirm current supply, quotation, and lead time through inquiry. Similar parameters do not establish direct replacement.

F411MR12W3M1HB11BPSA1 Specifications and Datasheet | ChipSourceHub